Brainport Industries Holland Innovative Koninklijke Metaalunie Mikrocentrum Nevat
  • Dutch Industrial Supply Pavilion

    Van 24 t/m 28 april 2017 vindt de Hannover Messe plaats. Voor de vierde keer zullen de organisaties, Nevat, Koninklijke Metaalunie, Holland Innovative, Brainport Industries en Mikrocentrum de handen ineen slaan om Hal 4 oranje te kleuren.

Hannover Messe
Dutch Industrial Supply Pavilion

24 t/m 28 april 2017  
Deutsche Messe, Hannover
Meer Informatie Gratis toegang

Optimal Total Cost of Ownership

With extensive experience, a wide international network and enthusiasm for the work that we do, Etchform provides innovative solutions with optimal Total Cost of Ownership during the entire lifecycle of your products.
Our core processes cover etching and electroforming, however, upon request, the entire supply chain can also be managed, for example for forming, heat and surface treatments and cleanroom packaging.

Our website provides a technology matrix in which the characteristics of different manufacturing technologies can be objectively compared with each other so that an initial decision on the most suitable process can be taken rationally.

The following advantages are inherent in our etching and electroforming processes:

-          From an individual item to series production.
-          Low one-off costs.
-          Short processing times and flexibility in terms of product changes.
-          A very broad range of materials to choose from, including metals on plastic substrates.
-          No change in material properties.
No added internal stress or deformation. Hardness and brittleness remain intact.
-          Completely burr-free products.
-          Both the contour and the relief can be formed in the same process.
-          Product complexity has hardly any effect on production costs.

In addition to “conventional” products such as shielding plates, deposition masks, gaskets, dosing rings, grids, cooling plates, heat sinks, contact springs, sieves, clamping plates and flow meters, there is also a wide range of highly specialised options, for example:

Burl plates
Surface structuring with precision of +/- 3 µm of a semiconductor wafer carrier bed to guarantee plate temperature.


Participation in DAISY2 (Daring Applications & Innovations in Sensor Systems), a collaborative project for an affordable AESA (active electronically scanned array) radar.



JUICE is the first large-class scientific mission (category L) in ESA’s “Cosmic Vision 2015–2025” programme. Etchform has been selected to carry out the feasibility study for the required solar connectors.


Titanium etching
Our 10+ years’ experience with our process for etching titanium which we developed in-house and which is considerably safer than the conventional process, has been so successful that we have begun to make preparations for doubling our production capacity which should be available by the start of 2018.

Ti implantat 


“If you can sketch it, we can etch it!”

Company details

Etchform BV
Arendstraat 51
NL-1223 RE Hilversum
Contact person: Johan van der Kraan
Tel.: +31 (0) 35 – 685 51 94


Solarverbinder Ti implantat
Solarverbinder  TI Implantat


Hall 4, Niederländische Gemeinschaftstand

Picture 1: Solarverbinder
Picture 2: TI Implantaat
Picture 3: Burplates
Picture 4: Daisy 2